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1. general description the 74lvc1g07 provides the non-inverting buffer. the output of this device is an open drain and can be connected to other open-drain outputs to implement active-low wired-or or active-high wired-and functions. inputs can be driven from either 3.3 v or 5 v devices. this feature allows the use of this device in a mixed 3.3 v and 5 v environment. schmitt-trigger action at all inputs makes the circuit tolerant for slower input rise and fall time. this device is fully speci?ed for partial power-down applications using i off . the i off circuitry disables the output, preventing the damaging back?ow current through the device when it is powered down. 2. features n wide supply voltage range from 1.65 v to 5.5 v n 5 v tolerant input/output for interfacing with 5 v logic n high noise immunity n complies with jedec standard: u jesd8-7 (1.65 v to 1.95 v) u jesd8-5 (2.3 v to 2.7 v) u jesd8-b/jesd36 (2.7 v to 3.6 v) n esd protection: u hbm jesd22-a114e exceeds 2000 v u mm jesd22-a115-a exceeds 200 v n - 24 ma output drive (v cc = 3.0 v) n cmos low power consumption n latch-up performance exceeds 250 ma n direct interface with ttl levels n inputs accept voltages up to 5 v n multiple package options n speci?ed from - 40 c to +85 c and - 40 c to +125 c 74lvc1g07 buffer with open-drain output rev. 08 17 july 2007 product data sheet
74lvc1g07_8 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 08 17 july 2007 2 of 14 nxp semiconductors 74lvc1g07 buffer with open-drain output 3. ordering information 4. marking 5. functional diagram table 1. ordering information type number package temperature range name description version 74lvc1g07gw - 40 c to +125 c tssop5 plastic thin shrink small outline package; 5 leads; body width 1.25 mm sot353-1 74lvc1g07gv - 40 c to +125 c sc-74a plastic surface-mounted package; 5 leads sot753 74lvc1g07gm - 40 c to +125 c xson6 plastic extremely thin small outline package; no leads; 6 terminals; body 1 1.45 0.5 mm sot886 74LVC1G07GF - 40 c to +125 c xson6 plastic extremely thin small outline package; no leads; 6 terminals; body 1 1 0.5 mm sot891 table 2. marking type number marking code 74lvc1g07gw vs 74lvc1g07gv v07 74lvc1g07gm vs 74LVC1G07GF vs fig 1. logic symbol fig 2. iec logic symbol fig 3. logic diagram mna623 ay 2 4 mna624 4 2 a y mna591 y a gnd
74lvc1g07_8 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 08 17 july 2007 3 of 14 nxp semiconductors 74lvc1g07 buffer with open-drain output 6. pinning information 6.1 pinning 6.2 pin description 7. functional description [1] h = high voltage level; l = low voltage level; z = high-impedance off-state. fig 4. pin con?guration sot353-1 and sot753 fig 5. pin con?guration sot886 fig 6. pin con?guration sot891 74lvc1g07 n.c. v cc a gnd y 001aab622 1 2 3 5 4 74lvc1g07 a 001aab623 n.c. gnd n.c. v cc y transparent top view 2 3 1 5 4 6 74lvc1g07 a 001aag422 n.c. gnd n.c. v cc y transparent top view 2 3 1 5 4 6 table 3. pin description symbol pin description sot353-1/sot753 sot886/sot891 n.c. 1 1 not connected a 2 2 data input gnd 3 3 ground (0 v) y 4 4 data output n.c. - 5 not connected v cc 5 6 supply voltage table 4. function table [1] input a output y ll hz
74lvc1g07_8 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 08 17 july 2007 4 of 14 nxp semiconductors 74lvc1g07 buffer with open-drain output 8. limiting values [1] the minimum input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] when v cc = 0 v (power-down mode), the output voltage can be 5.5 v in normal operation. [3] for tssop5 and sc-74a packages: above 87.5 c the value of p tot derates linearly with 4.0 mw/k. for xson6 packages: above 45 c the value of p tot derates linearly with 2.4 mw/k. 9. recommended operating conditions table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage - 0.5 +6.5 v i ik input clamping current v i <0v - 50 - ma v i input voltage [1] - 0.5 +6.5 v i ok output clamping current v o <0v - 50 - ma v o output voltage active mode [1] - 0.5 +6.5 v power-down mode [1] [2] - 0.5 +6.5 v i o output current v o = 0 v to 6.5 v - 50 ma i cc supply current - 100 ma i gnd ground current - 100 - ma t stg storage temperature - 65 +150 c p tot total power dissipation t amb = - 40 c to +125 c [3] - 250 mw table 6. recommended operating conditions symbol parameter conditions min typ max unit v cc supply voltage 1.65 - 5.5 v v i input voltage 0 - 5.5 v v o output voltage active mode 0 - 5.5 v power-down mode; v cc = 0 v 0 - 5.5 v t amb ambient temperature - 40 - +125 c d t/ d v input transition rise and fall rate v cc = 1.65 v to 2.7 v - - 20 ns/v v cc = 2.7 v to 5.5 v - - 10 ns/v
74lvc1g07_8 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 08 17 july 2007 5 of 14 nxp semiconductors 74lvc1g07 buffer with open-drain output 10. static characteristics [1] all typical values are measured at t amb = 25 c. [2] these typical values are measured at v cc = 3.3 v. table 7. static characteristics at recommended operating conditions; voltages are referenced to gnd (ground = 0 v). symbol parameter conditions - 40 c to +85 c - 40 c to +125 c unit min typ [1] max min max v ih high-level input voltage v cc = 1.65 v to 1.95 v 0.65v cc - - 0.65v cc -v v cc = 2.3 v to 2.7 v 1.7 - - 1.7 - v v cc = 2.7 v to 3.6 v 2.0 - - 2.0 - v v cc = 4.5 v to 5.5 v 0.7v cc - - 0.7v cc -v v il low-level input voltage v cc = 1.65 v to 1.95 v - - 0.35v cc - 0.35v cc v v cc = 2.3 v to 2.7 v - - 0.7 - 0.7 v v cc = 2.7 v to 3.6 v - - 0.8 - 0.8 v v cc = 4.5 v to 5.5 v - - 0.3v cc - 0.3v cc v v ol low-level output voltage v i = v ih or v il i o = 100 m a; v cc = 1.65 v to 5.5 v - - 0.10 - 0.10 v i o = 4 ma; v cc = 1.65 v - - 0.45 - 0.70 v i o = 8 ma; v cc = 2.3 v - - 0.30 - 0.45 v i o = 12 ma; v cc = 2.7 v - - 0.40 - 0.60 v i o = 24 ma; v cc = 3.0 v - - 0.55 - 0.80 v i o = 32 ma; v cc = 4.5 v - - 0.55 - 0.80 v i i input leakage current v i = 5.5 v or gnd; v cc = 0 v to 5.5 v [2] - 0.1 5- 100 m a i oz off-state output current v i = v ih or v il ; v o =v cc or gnd; v cc = 5.5 v - 0.1 10 - 100 m a i off power-off leakage current v i or v o = 5.5 v; v cc = 0 v - 0.1 10 - 200 m a i cc supply current v i = 5.5 v or gnd; i o = 0 a; v cc = 1.65 v to 5.5 v - 0.1 10 - 200 m a d i cc additional supply current per pin; v i = v cc - 0.6 v; i o = 0 a; v cc = 2.3 v to 5.5 v [2] - 5 500 - 5000 m a c i input capacitance v cc = 3.3 v; v i = gnd to v cc - 5.0 - - - pf
74lvc1g07_8 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 08 17 july 2007 6 of 14 nxp semiconductors 74lvc1g07 buffer with open-drain output 11. dynamic characteristics [1] typical values are measured at t amb =25 c and v cc = 1.8 v, 2.5 v, 2.7 v, 3.3 v and 5.0 v respectively. [2] t pd is the same as t plz and t pzl . [3] c pd is used to determine the dynamic power dissipation (p d in m w). p d =c pd v cc 2 f i n+ ? (c l v cc 2 f o ) where: f i = input frequency in mhz; f o = output frequency in mhz; c l = output load capacitance in pf; v cc = supply voltage in v; n = number of inputs switching; ? (c l v cc 2 f o ) = sum of outputs. 12. waveforms table 8. dynamic characteristics voltages are referenced to gnd (groun d = 0 v); for load circuit see figure 8 . symbol parameter conditions - 40 c to +85 c - 40 c to +125 c unit min typ [1] max min max t pd propagation delay a to y; see figure 7 [2] v cc = 1.65 v to 1.95 v 1.0 2.6 6.7 1.0 8.4 ns v cc = 2.3 v to 2.7 v 0.5 1.7 5.5 0.5 7.0 ns v cc = 2.7 v 0.5 2.3 4.7 0.5 6.0 ns v cc = 3.0 v to 3.6 v 0.5 2.2 4.2 0.5 5.5 ns v cc = 4.5 v to 5.5 v 0.5 1.6 3.5 0.5 4.5 ns c pd power dissipation capacitance v i = gnd to v cc ; v cc = 3.3 v [3] - 7.0 - - - pf measurement points are given in t ab le 9 . v ol is the typical output voltage level that occurs with the output load. fig 7. the input (a) to output (y) propagation delays mna626 t plz v x y output a input v i v cc v m v ol gnd t pzl v m
74lvc1g07_8 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 08 17 july 2007 7 of 14 nxp semiconductors 74lvc1g07 buffer with open-drain output table 9. measurement points supply voltage input output v cc v m v m v x 1.65 v to 1.95 v 0.5v cc 0.5v cc v ol + 0.15 v 2.3 v to 2.7 v 0.5v cc 0.5v cc v ol + 0.15 v 2.7 v 1.5 v 1.5 v v ol + 0.3 v 3.0 v to 3.6 v 1.5 v 1.5 v v ol + 0.3 v 4.5 v to 5.5 v 0.5v cc 0.5v cc v ol + 0.3 v test data is given in t ab le 10 . de?nitions for test circuit: r l = load resistance. c l = load capacitance including jig and probe capacitance. r t = termination resistance should be equal to the output impedance z o of the pulse generator. v ext = external voltage for measuring switching times. fig 8. load circuit for switching times v ext v cc v i v o mna616 dut c l r t r l r l g table 10. test data supply voltage input load v ext v cc v i t r , t f c l r l t pzl , t plz 1.65 v to 1.95 v v cc 2.0 ns 30 pf 1 k w 2v cc 2.3 v to 2.7 v v cc 2.0 ns 30 pf 500 w 2v cc 2.7 v 2.7 v 2.5 ns 50 pf 500 w 6 v 3.0 v to 3.6 v 2.7 v 2.5 ns 50 pf 500 w 6 v 4.5 v to 5.5 v v cc 2.5 ns 50 pf 500 w 2v cc
74lvc1g07_8 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 08 17 july 2007 8 of 14 nxp semiconductors 74lvc1g07 buffer with open-drain output 13. package outline fig 9. package outline sot353-1 (tssop5) unit a 1 a max. a 2 a 3 b p l h e l p wy v ce d (1) e (1) z (1) q references outline version european projection issue date iec jedec jeita mm 0.1 0 1.0 0.8 0.30 0.15 0.25 0.08 2.25 1.85 1.35 1.15 0.65 e 1 1.3 2.25 2.0 0.60 0.15 7 0 0.1 0.1 0.3 0.425 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 0.46 0.21 sot353-1 mo-203 sc-88a 00-09-01 03-02-19 w m b p d z e e 1 0.15 13 5 4 q a a 2 a 1 l p (a 3 ) detail x l h e e c v m a x a y 1.5 3 mm 0 scale tssop5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm sot353-1 1.1
74lvc1g07_8 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 08 17 july 2007 9 of 14 nxp semiconductors 74lvc1g07 buffer with open-drain output fig 10. package outline sot753 (sc-74a) references outline version european projection issue date iec jedec jeita sot753 sc-74a wb m b p d e a a 1 l p q detail x h e e v m a a b y 0 1 2 mm scale c x 13 2 4 5 plastic surface-mounted package; 5 leads sot753 unit a 1 b p cd e h e l p qy w v mm 0.100 0.013 0.40 0.25 3.1 2.7 0.26 0.10 1.7 1.3 e 0.95 3.0 2.5 0.2 0.1 0.2 dimensions (mm are the original dimensions) 0.6 0.2 0.33 0.23 a 1.1 0.9 02-04-16 06-03-16
74lvc1g07_8 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 08 17 july 2007 10 of 14 nxp semiconductors 74lvc1g07 buffer with open-drain output fig 11. package outline sot886 (xson6) terminal 1 index area references outline version european projection issue date iec jedec jeita sot886 mo-252 sot886 04-07-15 04-07-22 dimensions (mm are the original dimensions) xson6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm d e e 1 e a 1 b l l 1 e 1 0 1 2 mm scale notes 1. including plating thickness. 2. can be visible in some manufacturing processes. unit mm 0.25 0.17 1.5 1.4 0.35 0.27 a 1 max b e 1.05 0.95 d ee 1 l 0.40 0.32 l 1 0.5 0.6 a (1) max 0.5 0.04 1 6 2 5 3 4 6 (2) 4 (2) a
74lvc1g07_8 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 08 17 july 2007 11 of 14 nxp semiconductors 74lvc1g07 buffer with open-drain output fig 12. package outline sot891 (xson6) terminal 1 index area references outline version european projection issue date iec jedec jeita sot891 sot891 05-04-06 07-05-15 xson6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm d e e 1 e a 1 b l l 1 e 1 0 1 2 mm scale dimensions (mm are the original dimensions) unit mm 0.20 0.12 1.05 0.95 0.35 0.27 a 1 max b e 1.05 0.95 d ee 1 l 0.40 0.32 l 1 0.35 0.55 a max 0.5 0.04 1 6 2 5 3 4 a 6 (1) 4 (1) note 1. can be visible in some manufacturing processes.
74lvc1g07_8 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 08 17 july 2007 12 of 14 nxp semiconductors 74lvc1g07 buffer with open-drain output 14. abbreviations 15. revision history table 11. abbreviations acronym description cmos complementary metal oxide semiconductor dut device under test esd electrostatic discharge hbm human body model mm machine model ttl transistor-transistor logic table 12. revision history document id release date data sheet status change notice supersedes 74lvc1g07_8 20070717 product data sheet - 74lvc1g07_7 modi?cations: ? new package outline drawing for xson6/sot891. 74lvc1g07_7 20070515 product data sheet - 74lvc1g07_6 74lvc1g07_6 20040907 product data sheet - 74lvc1g07_5 74lvc1g07_5 20030307 product data sheet - 74lvc1g07_4 74lvc1g07_4 20021002 product data sheet - 74lvc1g07_3 74lvc1g07_3 20020528 product data sheet - 74lvc1g07_2 74lvc1g07_2 20010406 product data sheet - 74lvc1g07_1 74lvc1g07_1 20001122 product data sheet - -
74lvc1g07_8 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 08 17 july 2007 13 of 14 nxp semiconductors 74lvc1g07 buffer with open-drain output 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 16.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 16.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 16.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 17. contact information for additional information, please visit: http://www .nxp.com for sales of?ce addresses, send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors 74lvc1g07 buffer with open-drain output ? nxp b.v. 2007. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 17 july 2007 document identifier: 74lvc1g07_8 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 functional description . . . . . . . . . . . . . . . . . . . 3 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 recommended operating conditions. . . . . . . . 4 10 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 11 dynamic characteristics . . . . . . . . . . . . . . . . . . 6 12 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 13 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 16.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 16.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 17 contact information. . . . . . . . . . . . . . . . . . . . . 13 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

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